MCX370™ Heatsinks for AMD® socket A & Intel® Pentium® III

MCX370™ All Aluminum	MCX370™ Copper Base
Made in the USA      patented   DISCONTINUED
Nov 19, 2001 New product option. Introducing the MCXC370™. Specifically intended for extreme CPU operating conditions with all AMD socket A, and Intel® socket 370 motherboards.The MCXC370™ is a new option available for the MCX370™ HSF.  The 1/2" thick base is made of C110 copper instead of Aluminum. Except for weight, all other physical characteristics, including dimensions, pins, clips, and fan are identical. The copper base provides a heat capacity increase of 40% compared to the all aluminum version. The performance gain is considerable, resulting in a C/W of 0.18 (with Papst fan), compared to 0.21 for the MCX370™. This translates into two possible types of extreme applications: Ultra high CPU overclocking frequencies, when used with our 33CFM Papst fan  Extremely low noise levels at CPU factory settings, when used with low airflow fans tuned for quiet operations. See specifications here
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The Helicoid Pin design At the core of this cooling solution is a new patented helicoid pin design (U.S. patent 6,469,898) which increases the pin surface area by a ratio a 2:1 compared to plain pins . Increasing the surface area improves thermal dissipation (more surface available to dissipate heat in the environment).  The "ribbed" design also promotes micro-turbulence (locally accelerated airflow velocity), which further enhances mixing of the radiated heat into the environment.
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Fan mounting system Due to the pin configuration, the heatsink performs best with the fan blowing downwards.   The fan is mounted on rubber spacers, raising it .190" (48mm) above the heatsink. This translates into a slight performance gain, but more importantly this is intended to reduce noise. The improvement is in the order of  1 to 2 decibels. Another benefit from using rubber spacers between fan and heatsink, is to dampen the vibrations generated by the fan.
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Performance data Model C/W Fan Noise MXC370 .21 43 dBA MCXC370™ .18 43 dBA
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Overall quality Perfect contact between CPU and heatsink is critical for transferring the thermal load to the heat dissipation device.  For this reason, the heatsink base is lapped in-house using special lapping machines, and hand finished on granit polishing tables.The following is a picture comparing the base of the MCX370™ before and after lapping. Most competing products surface finish look like the "before" picture, displaying machining, or rough polishing marks.
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Usage with thermo-electric devices Both MCX and MCXC370™  are suitable for use with thermo-electric devices up to 40x40mm in size, and 80 Watts in power. At this time however, only the MCX370™ all aluminum heatsink is  available under the reference MCX370-T, including gasket and copper plate. This configuration is only suitable for use with Pentium® III, or Celeron® class processors, and is not recommended for use with AMD Thunderbird and Duron class processors.
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Specifications Heatsink body MCX370™ all aluminum MCXC370™ copper base Base dimensions 2.5x2.5x.5" - 63.5x63.5x12.7mm Base material Aluminum alloy 6063 (209 W/m-K) Copper C110 Base flatness better than .001" - 25µ Base micro surface finish 8 or better Heat dissipation medium 188 Helicoid pins (patented), made of high conductivity aluminum alloy 1100 (218 W/m-K) heatsink overall dimensions 2.5x2.5x1.63" - 63.5x 63.5x41.4mm Weight  8 oz - 227 g 17 oz - 482 g Mounting system: 2 retaining clips attaching to the socket (socket A, or socket 370) - Unequal length compression springs meet AMD and Intel® heatsink to CPU pressure specifications. Effective 10/17/2001 all MCX370™ series heatsink are shipped with the new 3 Tab clip design which grips all tabs on the socket as shown below. MCXC370 copper base heatsink warning (not applicable to the all aluminum MCX370):  the new 3 Tab clip does a flawless job at securely maintaining the HSF against the CPU during normal operations.  Nevertheless, due to it's heavy weight we recommend that the MCXC370 be uninstalled from the computer for transportation or shipping. Fan: Papst NHH612 -  60x60x25mm fan, 33 CFM - Rotation speed: 6850 RPM - Noise level: 43 dBA - No tachometer. 12 volt DC, 250mA, 3.0 Watts - 4 Pin Molex connector to the power supply (not to the motherboard) Mounting: 4 x 6-32 x 2.5" long screws and rubber spacers. heatsink/Fan Assembly: Overall dimensions with fan: 2.5" x 2.5" x 2.90" Weight (fully assembled with clips & fan):  MCX370™: 12 oz (340 g) MCXC370™: 21 oz (595 g)
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Manufacturer Suggested Retail Pricing The MCX370-B, and MCXC370-B bare OEM heatsinks are sold through distribution channels only. Model Description Fan Mounting Hardware & accessories MSRP in US$ MCX370 Complete retail package, all assembled Yes Fan & HS screws, clips, springs, Pentium® III pads, thermal grease $38 MCX370-B Bare OEM heatsink No Fan & HS screws, clips, springs, Pentium® III pads $20 MCXC370 Complete retail package, all assembled Yes Fan & HS screws, clips, springs, Pentium® III pads, thermal grease $48 MCXC370-B Bare OEM heatsink No Fan & HS screws, clips, springs, Pentium® III pads $30 Spare parts 3T Clip Set of two clips $2.50 Papst Fan Papst 33CFM 43 dBA fan, dressed with 4 pin Molex power connector $18 back to top