Made in the USA
(one or more patents pending)
DISCONTINUED
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Introduction
The MCW5002-AT™ is a fully assembled liquid-cooled thermoelectric
(Peltier) solution, specifically designed for AMD® "K7"
class (socket 462) microprocessors.
This unit is intended for advanced users in extreme microprocessor
cooling applications, such as extreme overclocking. The product
requires appropriate insulation measures to prevent the formation
of condensation in sensitive areas of the motherboard. Whereas
Swiftech provides gaskets, and specific installation instructions
for such assembly, utilization of this device is at the sole risk
of the user.
Major features:
- 226Watts 25A at 12V thermoelectric module
- 1/2" barb fittings, for maximum flow rate
- Patent pending Diamond-Pin Matrix© copper base plate
for optimal heat transfer, and turbulent flow:
- "Dropped-deck" housing,
to increase cooling fluid velocity through the Diamond-Pin Matrix©
area.
- Retention mechanism to the socket does not require removal
of the motherbord for installation.
- Fully gasketed assembly for condensation control
Thermoelectric cooling benefits
- Up to 50°C drop in processor operating temperature
- Solid state module reliability (50,000 hours MTBF)
- More versatile than vapor compression systems: can be used
with almost any chassis with our MCB-120 "Radbox"
external radiator mounting system
- More economical and easier to implement than vapor compression
systems
What can be expected in terms of overclocking ?
The integrated circuit industry rule of thumb states that an
IC will gain an average of 2 to 3% in operating frequency for
every 10°C drop in operating temperature. The chart below
is helpful in estimating what the processor temperature will
be after installation of the MCW5002-AT, and thus projecting
the microprocessor frequency gain using this rule of thumb.
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Example of installation
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Specifications
Performance data
Thermolectric module characteristics
| Couples |
U max |
I max |
DT max |
Q max |
L ×W×H(mm) |
R(Ω) |
| 127 |
15.2 VDC |
24 A |
>67 ° C |
226.1 W |
50 × 50 × 3.10 |
0.48 |
| Measured power draw at 12 VDC: 18A |
Power Supply requirements
- Auxiliary power supply :
- The TEC module is provided with "bare wires"
to facilitate installation with screw type terminals.
- We recommend the "Meanwell S320-12" power supply,
rated for 25A at 12 Volts, and available here.
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Gasketed Assembly:
The area surrounding the CPU is entirely
gasketed for superior condensation control and long term
reliability
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Housing:
The upper deck of the housing is lowered to increase flow
velocity through the Diamond-Pin Matrix©. This in effect
improves the rate of heat transfer to the cooling fluid,
and results in overall improved performance.
- CNC machined aluminum L2.5"xW2.5"xH1.5"
- Type II, class 2 blue anodized anti-corrosion treatment
- Built-in quick-connect fittings for 1/2" OD tubing
(3/8" ID)
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Base plate:
- 0.500" (12.7mm) thick CNC machined copper base
plate
- Submersed face (0.250"/6.35mm) is CNC machined
from billet to form Patent Pending Diamond-Pin Matrix©.
Design increases heat dissipation surface, and flow turbulence
to enhance heat transfer to cooling fluid.
- Outer face is lapped flat to 3/10 of 1/1000",
and near-mirror polished.
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Assembly:
- Retention mechanism:
- AMD® "K7" class processors (socket
462), retention mechanism to socket 462 lugs.
- Hose barbs: 1/2" barb to 3/8" NPT thread
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MSRP & Parts
Please consult your Swiftech distributor prior to ordering direct
from us, or purchase the product factory direct here
Part #
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Description |
Availability
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Price |
| MCW5002-AT™ for AMD® |
Assembly, including housing, copper plate, installation
hardware, 1/2" barb fittings, all gaskets, Arctic Alumina
thermal compound, instructions |
1-2 weeks
standard turnaround |
$125.00 |
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MCW5002-AT™
LIQUID COOLED THERMOELECTRIC ASSEMBLY FOR AMD® "K7" CLASS
PROCESSORS (socket 462)
