MCW5002-64T™ LIQUID COOLED THERMOELECTRIC ASSEMBLY FOR AMD® "K8" CLASS PROCESSORS (socket754 and 939)

Made in the USA       (one or more patents pending) DISCONTINUED

Introduction The MCW5002-64T™ is a fully assembled liquid-cooled thermoelectric (Peltier) solution, specifically designed for AMD® "K8" class (socket 754 and 939) microprocessors. This unit is intended for advanced users in extreme microprocessor cooling applications, such as extreme overclocking. The product requires appropriate insulation measures to prevent the formation of condensation in sensitive areas of the motherboard. Whereas Swiftech provides gaskets, and specific installation instructions for such assembly, utilization of this device is at the sole risk of the user. Major features 226Watts 25A at 12V thermoelectric module 1/2" barb fittings, for maximum flow rate Patent pending Diamond-Pin Matrix© copper base plate for optimal heat transfer, and turbulent flow: "Dropped-deck" housing, to increase cooling fluid velocity through the Diamond-Pin Matrix© area. Bolts directly onto stock AMD retention frame Fully gasketed assembly for condensation control Thermoelectric cooling benefits Up to 50°C drop in processor operating temperature Solid state module reliability (50,000 hours MTBF) More versatile than vapor compression systems: can be used with almost any chassis with our MCB-120 "Radbox" external radiator mounting system More economical and easier to implement than vapor compression systems What can be expected in terms of overclocking ? The integrated circuit industry rule of thumb states that an IC will gain an average of 2 to 3% in operating frequency for every 10°C drop in operating temperature. The chart below is helpful in estimating what the processor temperature will be after installation of the MCW5002-64T, and then project the microprocessor frequency gain using this rule of thumb.

Example of installation The MCW5002-64T bolts directly onto AMD stock retention frame (click on picture to enlarge) back to top

Specifications Performance data Thermolectric module characteristics Couples   U max   I max   DT max   Q max   L ×W×H(mm)   R(Ω)   127 15.2 VDC 24 A >67 ° C 226.1 W 50 × 50 × 3.10 0.48   Measured power draw at 12 VDC: 18A Power Supply requirements Auxiliary power supply : The TEC module is provided with "bare wires" to facilitate installation with screw type terminals. We recommend the "Meanwell S320-12" power supply, rated for 25A at 12 Volts, and available here. While it is possible to connect the MCW5002-64T to the computer power-supply, users should be aware that only high-end power-supplies can accomodate the Peltier module 18amps current draw (at 12 volts). Accordingly, users should verify that their power supply features at least a 40 Amps ratings for the +12 volts rail. Exploded view of the assembly back to top Components specifications Housing: The upper deck of the housing is lowered to increase flow velocity through the Diamond-Pin Matrix©. This in effect improves the rate of heat transfer to the cooling fluid, and results in overall improved performance. CNC machined aluminum L2.5"xW2.5"xH1.5" Type II, class 2 blue anodized anti-corrosion treatment Built-in quick-connect fittings for 1/2" OD tubing (3/8" ID) Base plate: 0.500" (12.7mm) thick CNC machined copper base plate Submersed face (0.250"/6.35mm) is CNC machined from billet to form Patent Pending Diamond-Pin Matrix©. Design increases heat dissipation surface, and flow turbulence to enhance heat transfer to cooling fluid. Outer face is lapped flat to 3/10 of 1/1000", and near-mirror polished.   Cold Plate: 0.500" (12.7mm) thick CNC machined copper base plate. Exceptional quality and attention to details: the cold plate base is lapped to 0.0003" (3/10 of 1/1000"), and polished to near-mirror finish to promote optimum thermal conductivity. Users are advised that while flatness is strictly respected for providing the most significant benefit to thermal interface, surface polish is a cosmetic component and may vary slightly from one heatsink to another. Re-lapping or polishing the copper base is never recommended. Assembly: Overall dimensions including retention frame: L3.3" x W2.7" x H2.3" (L83.8 x W68.6 x H58.4 mm) - This fits inside of AMD® socket 754 & 939 retention frame. Retention mechanism: AMD® "K8" class processors (socket 754 & 939). Hose barbs: 1/2" barb to 3/8" NPT thread back to top

MSRP & Parts Please consult your Swiftech distributor prior to ordering direct from us, or purchase the product factory direct here Part # Description Availability Price MCW5002-64T™ for AMD® "K8" processors Assembly, including housing, copper plate, installation hardware, 1/2" barb fittings, all gaskets, Arctic Alumina thermal compound, instructions 1-2 weeks standard turnaround $125.00