H20-8600™ SERIES LIQUID COOLING KITS - DISCONTINUED & REPLACED BY MODEL # H20-80 H20-8600P™ Introduction The H20-8600™ series liquid cooling kits continue our tradition of truly plug-and-play components with the added performance and value of the new generation of MCW6000™ water-blocks. These kits are specifically intended to bring the efficiency, and quiet operations of liquid cooling to confined environments. They require no case modifications, and may be installed with all existing components already in place inside the chassis (*) The H20-8600™ series kits include a number of options to accomodate most configurations, from mild to extreme cooling, and they are ideally suited for any chassis featuring 80mm fan intake and/or exhaust openings. Performance features: Extreme performance MCW6000™ series water-blocks Extreme performance MCP600™ 12 Volts DC industrial pump 1/2" OD tubing for optimum flow rate, and reasonable bulk Good balance for performance versus noise is achieved with a single MCR80-F1 80mm copper-core radiator featuring an 80x25mm fan optimized for low noise (28dbA) and high back pressure. Extreme performance can be achieved by adding a second MCR80-F1 for a gain of up to 5°C. Convenience & reliability features: 12 Volt DC pump plugs directly into computer power supply High-reliability, no-maintenance industrial pump features quiet operations thanks to brushless motor, and provides tens of thousands of hours of uninterrupted service. FBK525 fill & bleed assembly fits entirely into a single 5 1/4" bay : no reservoir is needed, resulting in space saving, and uncluttered installation. 80mm form factor radiator fits into any chassis featuring at least one 80mm opening for fan intake or exhaust Safety: Ability to leak-proof the system with no liquid in it. This allows users to install the cooling kit in a system already populated with all its components safely. Quick-connect fittings, for safe and expeditious installation. Plug-and-play water-block installation, doesn't require removing the motherboard Coolsleeves™ coils completely eliminate flattening of the tubes over time, and enable users to bend soft vinyl tubing at extremely sharp radii without kinking. Optional devices and configurations: Add a VGA cooler such as the MCW50™ Add a chipset cooler such as the MCW20™ Add a second water block for multiprocessor applications, such as dual AMD®, dual Xeon™, or dual Opteron™. Add a second radiator for a performance gain of 5°C average at equal heat load. Note: this option is always recommended in dual processor configurations Examples of installation on an AMD® K7 platform. Picture 1 includes andMCW6000-A™ CPU cooler, MCW20-A™ chipset cooler, and MCW50 VGA™ cooler, and picture 2 is the same setup with an extra MCR80-F2 radiator. Note the tight and "clean" radii that can be achieved with the coolsleeves™ coils. click on picture to enlarge ..and the dual radiator setup click on picture to enlarge Performance data To characterize the kits' performance with different configurations, each kit was installed in a bare chassis with a heat die simulator and then tested in an environmental chamber where the radiator fan inlet air temperature was held at 25.00°C ±0.02. The thermal resistance of the system could then be characterized by the difference between the fan's inlet air temperature and the heat die, divided by the heat load in Watts; such ratio is commonly referred to as the "C/W". The results below are accurate and comparable as the only variables were the radiators, and fan voltages. When the MCW20 and MCW50 were added, a 50% higher heat load was induced in order to simulate the combined heat load produced by a high-end VGA adapter and a Northbridge chipset. Users comparing their or other systems and data are cautioned that such comparability is tightly dependant upon how accurately the heat load (Watts) is characterized. Kit Model Radiator/Fan configuration Heat load(*) Watts (bench load / estimated processor load) System °C/W(**) H20-8600™ 1 radiator, fan operating at 12 volts 69/~100 0.340 H20-8600™ 2 radiators in series, fans operating at 7 volts 69/~100 0.343 H20-8600™ 2 radiators in parallel, fans operating at 7 volts 69/~100 0.341 H20-8600™ 2 radiators in series, fans operating at 12 volts 69/~100 0.293 H20-8600™ 2 radiators in parallel, fans operating at 12 volts 69/~100 0.291 H20-8600™ with MCW50 VGA cooler and MCW20 Chipset cooler 2 radiators in parallel, fans operating at 12 volts 104/~150 0.299 *actual Watts measured at heater of die simulator / estimated processor load per "Radiate" (CPU wattage estimation program) or similar **Noting that “C/W”s are specific to an individual test bench (due to the lack of standard test methods); the system C/Ws described are those actually determined with a kit using our heat die simulator as a heat source and mounted in a chassis, placed in an environmental chamber where the radiator fan inlet air temperature was held at 25.00°C ±0.02. From the above several generalizations can be made: Adding a second radiator will drop the temperatures by close to 5°C (depending on the heat load) 2 radiators at 7V are equivalent to 1 radiator at 12V Adding a MCW50™ GPU waterblock and a MCW20™ Northbridge waterblock, with a 50% increase in total heat, increases the temperature by approximately 1°C back to top INDIVIDUAL AND OPTIONAL COMPONENTS SPECIFICATIONS MCW6000™ CPU water-block: see complete specifications here MCP600™ 12 Volts DC pump: see complete specifications here MCW50™ VGA water-block: see complete specifications here MCW20™ Chipset cooler: see complete specifications here MCR80-F2 Radiator assembly 2-pass 80 mm radiator specifically developed for PC CPU and VGA water-cooling Double-row high internal volume design High-gloss acrylic paint finish Tested in our labs and rated for 100 Watts with a 15°C coolant temperature rise. 80 mm (3 inch) Copper core consisting of flat tubes for maximum heat conductivity High-density copper fin configuration for enhanced heat dissipation Built-in enhanced depth plenum chamber for increased performance and noise reduction even when using high-speed 80mm fans. The 3/8" OD inlet and outlet are fitted with our quick-connect adapters for use with 1/2" OD tubing. Radiator Assembly Dimensions - Part # MCR80-F2 Thickness Height Core width Inlet Outlet tube size 3.2" (81.6mm) 4.1" (104.8mm) 3.25" (82.5mm) 3/8" OD with quick connect adapters for 1/2" OD tubing Fan Specifications - Part # AFB0812M Voltage (V) Current (mA) Speed (RPM) Volume (CFM) Static pressure (InH20) Sound Noise (dbA) 12 180 2700 31.4 .129 28   FBK525 Fill & bleed assembly This 1/2" fill & bleed kit replaces a reservoir. It fits in any 5 1/4" bay, and occupies only one slot. Thanks to convenient retention clips, the FBK-525 can be installed just about anywhere in the computer. New inlet and discharge ball valves also offer added convenience for quick and easy insertion and removal of the tubes. The FBK525 allows users to fill the cicuit with coolant, and conveniently bleed it of any air bubles. The kit ships with two 2 1/2ft long, 1/2" tubes for fill and bleed operations. Inherent advantages of this kit compared to previous versions are: Height: fits entirely into (1) one 5 1/4" bay. Snap-in retention clips allow greater flexibility of placement anywhere inside the chassis. Possible installation of a rheobus in the same slot as the FBK525 Direct access to the inlet and discharge valves from the front of the chassis New inlet and discharge quick-connect ball valves feature easy tube insertion and removal. Advantages of such kit versus 5 1/4" reservoirs are also multiple: Safety: Ability to leak-proof the system with no liquid in it, by placing the circuit under vacuum (simple suction per installation guide page 4). This allows users to install the cooling kit in a system already populated with all its components safely. Efficiency: Most 5 1/4" reservoirs are too shallow to prevent air entrainment by the cooling fluid with high capacity pumps. It means that the level of the reservoir coolant above the pump inlet is not high enough to prevent the inlet suction from pulling in air. The high turbulence generated at the reservoir inlet can also create bubbles (admix air) into the coolant which transfer back into the pump inlet. Noisy operation, damage to the pump, and degraded cooling performance are high probabilities. Safety: the FB525™ kit allows system builders to ship pre-filled systems with no worries for leaks. back to top (*) to the exception of the optional chipset cooler, which requires removal of the motherboard. NEXT PAGE >>