Introduction
The H20-80™ series liquid cooling
kits continue our tradition of plug-and-play and balanced
performance vs. noise cooling systems. The kits' reliability
factor is now enhanced compared to earlier 8600 series
models thanks to the replacement of the MCP600™ pump
by the new MCP650™, which
features a 5 year lifetime.
These kits are specifically intended
to bring the efficiency, and quiet operations of liquid
cooling to confined environments. They require no case
modifications, and may be installed with all existing
components already in place inside the chassis (*)
The H20-80™ series kits include
a number of options to accommodate most configurations,
from mild to extreme cooling, and they are ideally suited
for any chassis featuring 80mm fan intake and/or exhaust
openings.
Performance features:
- Extreme performance MCW6000™
series water-blocks
- Extreme performance MCP650™
12 Volts DC industrial pump
- 1/2" OD tubing for optimum flow
rate, and reasonable bulk
- Good balance for performance versus
noise is achieved with a single MCR80-F1
80mm copper-core radiator featuring an 80x25mm fan optimized
for low noise (28dBA) and high back pressure.
- Extreme performance can be achieved
by adding a second MCR80-F1 for a gain of up to 5°C.
Convenience & reliability features:
- 12 Volt DC pump plugs directly into
computer power supply
- High-reliability, no-maintenance
industrial pump features quiet operations thanks
to brushless motor, and is rated at 50,000 hour MTBF(Mean
Time Between Failures) equivalent to 5 year lifetime
- FBK525
fill & bleed assembly fits entirely into a single
5 1/4" bay : no reservoir is needed, resulting
in space saving, and uncluttered installation.
- 80mm form factor radiator fits into
any chassis featuring at least one 80mm opening for
fan intake or exhaust
- Safety: Ability to leak-proof
the system with no liquid in it. This allows
users to install the cooling kit in a system already
populated with all its components safely.
- Quick-connect fittings, for safe and
expeditious installation.
- Plug-and-play waterblock installation,
doesn't require removing the motherboard
- Coolsleeves™
coils completely eliminate flattening of the tubes over
time, and enable users to bend soft vinyl tubing at
extremely sharp radii without kinking.
Optional devices and configurations:
- Add a VGA cooler such as the MCW50™
- Add a chipset cooler such as the MCW20™
- Add a second water block for multiprocessor
applications, such as dual AMD®, dual Xeon™,
or dual Opteron™.
- Add a second radiator for a performance
gain of 5°C average at equal heat load. Note: this
option is always recommended in dual processor configurations
Kit configurations & Models: See
page 2
Examples of installation on an AMD®
K7 platform.
Picture 1 includes an MCW6000-A™
CPU cooler, MCW20-A™ chipset cooler, and MCW50
VGA™ cooler, and picture 2 is the same setup with
an extra MCR80-F2 radiator. Note the tight and "clean"
radii that can be achieved with the coolsleeves™
coils.
Click on picture to enlarge
..and the dual radiator setup
Click on picture to enlarge
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Performance
data
To characterize the kits' performance
with different configurations, each kit was installed
in a bare chassis with a heat die simulator and then
tested in an environmental chamber where the radiator
fan inlet air temperature was held at 25.00°C ±0.02.
The thermal resistance of the system
could then be characterized by the difference between
the fan's inlet air temperature and the heat die, divided
by the heat load in Watts; such ratio is commonly referred
to as the "C/W".
The results below are accurate and comparable
as the only variables were the radiators, and fan voltages.
Users comparing their or other systems and data are
cautioned that such comparability is tightly dependent
upon how accurately the heat load (Watts) is characterized.
|
Kit Model
|
Radiator/Fan
configuration (*)
|
|
System °C/W
(***)
|
Fan Noise, dBA
(per specs, and est.****)
|
|
H20-80™
|
1 radiator
|
114 Watts
|
0.287
|
28
|
|
H20-80™
|
2 radiators in
series
|
114 Watts
|
0.232
|
~31
|
* Testing performed with the fan(s) shipped with the
kit
** actual Watts measured at the heater of die simulator
*** Noting that "C/W"s are specific to an
individual test bench (due to the lack of standard test
methods); the system C/Ws described are those actually
determined with a specific water-cooling kit under the
conditions described above.
**** Fan noise estimate based on: "If the speed
of a fan is reduced by 20%, the decibel level will reduce
by 5 dB.", and "addition of a second equal
source increases the sound level by ~3dBA".
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INDIVIDUAL AND OPTIONAL
COMPONENTS SPECIFICATIONS
- MCW6000™ CPU waterblock: see complete
specifications here
- MCP650™ 12 Volts DC pump: see
complete specifications here
- MCW50™ VGA waterblock: see complete
specifications here
- MCW20™ Chipset cooler: see complete
specifications here
- 2-pass 80 mm radiator specifically
developed for PC CPU and VGA water-cooling
- Double-row high internal volume design
- High-gloss acrylic paint finish
- Tested in our labs and rated for 100
Watts with a 15°C coolant temperature rise.
- 80 mm (3 inch) Copper core consisting
of flat tubes for maximum heat conductivity
- High-density copper fin configuration
for enhanced heat dissipation
- Built-in enhanced depth plenum chamber
for increased performance and noise reduction even when
using high-speed 80mm fans.
- The 3/8" OD inlet and outlet are
fitted with our quick-connect adapters for use with
1/2" OD tubing.
|
Radiator Assembly
Dimensions - Part # MCR80-F2
|
|
Thickness
|
Height
|
Core width
|
Inlet Outlet tube
size
|
|
3.2"
(81.6mm)
|
4.1"
(104.8mm)
|
3.25"
(82.5mm)
|
3/8" OD
with quick connect
adapters for
1/2" OD tubing
|
|
Fan Specifications
- Part # AFB0812M
|
|
Voltage
(V)
|
Current
(mA)
|
Speed
(RPM)
|
Volume
(CFM)
|
Static
pressure
(InH20)
|
Sound
Noise
(dBA)
|
|
12
|
180
|
2700
|
31.4
|
.129
|
28
|
This 1/2" fill & bleed kit replaces
a reservoir. It fits in any 5 1/4" bay, and occupies
only one slot. Thanks to convenient retention clips, the
FBK525 can be installed just about anywhere in the computer.
New inlet and discharge ball valves also offer added convenience
for quick and easy insertion and removal of the tubes.
The FBK525 allows users to fill the circuit
with coolant, and conveniently bleed it of any air bubbles.
The kit ships with two 2 1/2ft long, 1/2" tubes for
fill and bleed operations.
Inherent advantages of this kit compared
to previous versions are:
- Height: fits entirely into (1) one
5 1/4" bay.
- Snap-in retention clips allow greater
flexibility of placement anywhere inside the chassis.
- Possible installation of a rheobus
in the same slot as the FBK525
- Direct access to the inlet and discharge
valves from the front of the chassis
- New inlet and discharge quick-connect
ball valves feature easy tube insertion and removal.
Advantages of such kit versus 5 1/4"
reservoirs are also multiple:
- Safety: Ability to leak-proof
the system with no liquid in it, by placing
the circuit under vacuum (simple suction per installation
guide page 4). This allows users to install the
cooling kit in a system already populated with all its
components safely.
- Efficiency: Most 5 1/4"
reservoirs are too shallow to prevent air entrainment
by the cooling fluid with high capacity pumps. It means
that the level of the reservoir coolant above the pump
inlet is not high enough to prevent the inlet suction
from pulling in air. The high turbulence generated at
the reservoir inlet can also create bubbles (admix air)
into the coolant which transfer back into the pump inlet.
Noisy operation, damage to the pump, and degraded cooling
performance are high probabilities.
- Safety: the FBK525™ kit
allows system builders to ship pre-filled systems with
no worries for leaks.
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(*) to the exception
of the optional chipset cooler, which requires removal
of the motherboard.
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