MC370 heatsinkS
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PRODUCT REVIEWS (click on site's logo to read the review)
Curious on how to assemble the MC370 cooler ? Go to our Instructions Manual Curious on what performance to expect with our active cooling system ? Users report are here - Our own tests are here MAJOR PRODUCT UPGRADES:
MC370-3 Active Cooler Replaced by the MC371 effective Sep 23, 2000 For the following CPU's: Socket 370 form factors (not recommended for socket A) AMD K6, Intel® Celeron® PGA, Pentium® III Coppermine, Celeron® II FC-PGA The MC370 cooler takes advantage the of MC2000/MC1000 technology and is meant to fit socket 7, socket A, and socket 370 (PGA, FC-PGA) motherboards, including dual processors. The cooler also fits Slocket adapters and can be mounted to slot one motherboards. The heatsink is exactly half the size of the MC1000 (2.5" x 2.5") while retaining the same massive 1/2" base and uses one "military specs" 60mm fan (33 cfm). The sides of the heatsink have been extruded to provide clearance for the large capacitors surrounding some socket 370 motherboards. The MC370 is available in the following versions :
Note: bare heatsinks also available, see price-list at the end SIZE ISSUE with slot 1 motherboards in the MC370-3 & -4 Models (click on image to enlarge)
Because of the longer pins, these heatsinks will block DIMM slots on most slot one motherboards, number of which depends on the layout of the mother board. Please refer to the above schematic for measurements. For this reason, we have developed the same side exhaust air duct as the MC1000. This configuration allows us to clear any motherboard, while slightly enhancing airflow thanks to a venturi effect, AND reducing noise! Two models of shrouds are available: the SE370-90, and the SE370-135. The "135" was recently released to allow installation in dual slot one motherboards , as shown in the schematic below.
Note: The SE370-90 and SE370-135 air ducts are designed for the MC370-3/4 "long pins" heatsinks ONLY Mounting The MC370 assembly attaches to the socket with two metal straps . In contrast to the simple spring clips used by other coolers, these straps guarantee appropriate assembly pressure, (an important factor in reducing thermal resistance between the different components) while maintaining a solid hold onto the socket for our heavy heatsink. Securing to the motherboard (models MC370-3 and -4 with shroud): Once assembled with their shroud, the MC370-3 and -4 can be secured to the motherboard with two brackets provided with the accessories, that attach to the motherboard as follows (click on picture to enlarge):
Performance - benchmark reports (see also the CPU temperature Database HERE) MC370-3 and 4 System configuration: Soyo 6BA+IIII with Iwill Slocket II adapter, PIII CopperMine 550 processor at 800Mhz at 1.6 volts- FS020 Server case (case closed). Test: Prime95, duration 30 minutes each test. Temperature measured by the core's thermal diode. Both MC370 heatsinks equipped with Side Exhaust air duct.
Power Requirements:
MC370-3-4: Power requirements are quite close to the MC1000 in a single CPU environment, i.e. a 300 Watts rated at 12 amps at 12 volts, and to the MC2000 in a dual CPU environment. This means that a 400+ Watts power supply will be necessary in most dual CPU configurations. Mounting issues: Mounting the MC370 requires special attention, and we have
developed a safe and effective method which guarantees appropriate
mounting in 100% of the cases. It is critical to
have a perfect contact and sufficient pressure between the
thermoelectric and the CPU, otherwise cooling will be dramatically
compromised.
Condensation issues: Condensation around the TEC is effectively eliminated thanks to a silicone based closed cell foam gasket which completely encloses the CPU/TEC area. The MC370-3 AND -4, due to their powerful TEC, requires some work in order to completely eliminate any chances of condensation taking place inside or behind the socket and motherboard: Filling up the cavity inside the socket, as shown in the picture below is the first step to take. We also recommend that the socket itself be sealed with silicone all around, where it sits on the motherboard. Here is a picture that illustrates both the cavity filling and the socket sealing (click to enlarge): We also provide a 2.5" x 2.5" patch of neoprene which needs to be affixed to the back of the motherboard (it has a peel-off back and a very sticky film of glue). This patch, by eliminating air circulation in the coldest area behind the motherboard, effectively eliminates any chances of condensation taking place there. This obviously requires that the motherboard be removed form the Case though... A final touch would be to coat the CPU platform itself, and the edge of the processor with a thin coat of silicone. This would prevent any icing to form at the edge of the processor (although we have not observed any icing taking place there so far), and water droplets to create shorts between the pinheads on the CPU platform. Here is how we do it when we ship an MC1000PGA /processor combo: Disclaimer: We very effectively control condensation in our slot one designs. However, in the socket 370 design, and particularly in case of the MC370--3 and -4 coolers, we rely on your good judgment to follow our recommendations in order to prevent condensation. These recommendations however, are not represented as being the final word and the absolute cure to condensation issues. They are merely precautions that users should take, and may or may not prevent condensation to take place depending on your particular configuration and ambient temperature. Execution is up to you, and we do not and cannot assume ANY liability should damage occur to your computer as a result of the use of these products, for any reason or cause. Specs at a glance: MC370-3, MC370-4
Pricing: please go to our "Air Cooling" page
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The MC370 also fits in slot 1 motherboards Seen here in a Soyo 6BA+IV |
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The MC370 on a slocket adapter. Click to enlarge |
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